LPC-875

SKU LPC-875
STORE DESCRIPTION:

Powerful, Rugged & Versatile Wide Temp Fanless PC.

-Intel® 10th Gen Core™ i5, i7, i9, Xeon Processors

-Up to 64GB ECC/Non-ECC Memory, 3x SSD Drives (2x Removable)

-2x DisplayPorts, 1x DVI-I Port, 2x Gigabit LAN Ports

-9-48V DC Power Supply

-4x RS232 COM ports

-Expandable I/O options for 10Gb LAN, POE+, USB 3.0, 5G using Universal Bay Kits

-Optional Single/Dual Channel CAN-BUS

-TPM 2.0

- UL 6238-1 and CSA C22.2 No. 6238-1:19

-CE, FCC & RoHS Compliant

-Wide Operating Temp (-25°C to 70°C / -13°F to 158°F)

Standard 3-Year Warranty

Also available as:

LPC-870: Fanless PC - Optional Wide Operating Temperature: 0°C to 40°C (32°F to 104°F)
SR-2870: 2U Rack Mount - Standard Operating Temperature: 0°C to 40°C (32°F to 104°F)
SR-2875: 2U Rack Mount - Optional Wide Operating Temperature: -25°C to 70°C (-13°F to 158°F)

$4,295.00
(0)No Reviews yet
* Product images are for illustration purposes only and may not be an exact representation of the item
Back

LPC-875 – Powerful, Rugged & Versatile Fanless PC

The LPC-875 is engineered for high-end performance in harsh or mobile environments. With a fanless rugged chassis and support for Intel® 10th Generation Core™ and Xeon® mobile processors, this system delivers reliability, flexibility and durability in demanding field, industrial or transportation scenarios.


Key Benefits:

-High-performance Intel® 10th Gen Core™ i5/i7/i9 & Xeon® mobile CPUs with dual DDR4 sockets (up to 64 GB, ECC support for Xeon).

-Rugged fan-less chassis (silent operation) with dual removable front SSD drives and extensive I/O (8× DIO ports, serial, audio, USB, etc.)

-Wide-range 9-48 V DC input (ideal for mobile/vehicle or field deployment) plus cold-temp operating range of -25 °C to +70 °C (-13 °F to +158 °F).

-Triple-display support in 4K Ultra HD (via DVI-I + 2× DisplayPort) plus optional CAN bus, RAID storage and advanced expansion slots.

-TPM 2.0 standard for enhanced security and CE/FCC/RoHS compliance


Applications:

Industrial automation, mobile/vehicle computing, digital signage, field data-acquisition systems, rugged control systems and embedded computing in transportation or defence.